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Increasing demand for consumer electronic devices are expected to drive innovation in wafer processing equipment manufacturing, thus driving the market during the forecast period.

The global wafer processing equipment market is expected to grow from $138.3 billion in 2022 to $150.46 billion in 2023 at a compound annual growth rate (CAGR) of 8.8%. The global wafer processing equipment market size is expected to grow to $202.79 billion in 2027 at a CAGR of 7.7%.

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Global Wafer Processing Equipment Market Segments Include:

• By Equipment Type: Oxidation Systems, Diffusion Systems, Epitaxial Reactors, Photolithography Equipment, Other Equipment Types
• By Application: MEMS, RFID, CMOS Image Sensor, Other Applications
• By End Use: Medical, Military, Solar, Industrial, Other End Uses
• By Geography: The market is segmented into North America, South America, Asia-Pacific, Eastern Europe, Western Europe, Middle East and Africa. Among these regions, Asia Pacific is the largest region in the global wafer processing equipment market in 2021.

Major Market Players in the wafer processing equipment market include Lam Research Corporation, Tokyo Electron Limited, Applied Materials Inc., SPTS Technologies Limited, Plasma-Therm LLC., Disco Corporation.

Growing demand for miniaturized wafers with the improved performance of devices is a leading trend in the wafer processing equipment market. Semiconductor substrates such as wafers are thinned down to final thicknesses of tens of µm. Most of the semiconductor wafers such as those used in memory, CIS, and power applications are thinned down to 100 µm-200 µm. Further thickness reduction with the necessity to maximize the memory capacity of single packages, improved data transfer rates, and power consumption mostly fuelled by mobile applications is required in the case of memory devices. Standard memory devices such as 2D NAND/DRAM use silicon wafers that are thicker than 200 µm. By 2025, 3D stacked DRAM thickness is expected to keep reducing from 50 µm – 30 µm thick silicon substrates. Currently, BSI CIS wafers are the thinnest wafers across all applications with a thickness below 10 µm. Thus, ultra-smooth surfaces and thinner wafers for incorporation into the devices are continuously gaining popularity in recent years.

The Wafer Processing Equipment Global Market Report 2023  provides a wafer processing equipment market overview for the time series: historic years (2010 – 2021) and ten years forecast (2023 – 2032). The wafer processing equipment market forecast analyzes wafer processing equipment market size, wafer processing equipment market share, leading competitor market positions. The regions covered in the report include Asia-Pacific, China, Western Europe, Eastern Europe, North America, USA, South America, Middle East and Africa and the countries include Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA.

Wafer processing equipment refer to equipment used to convert semiconductors such as gallium arsenide and crystalline silicon germanium into thin round slices, which can be used as a substrate for microelectronic devices.

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