The Business Research Company’s global market reports are now updated with the latest market sizing information for the year 2023 and forecasted to 2032

The global 3D IC and 2.5D IC packaging market is set to scale new heights, projecting a growth from $43.32 billion in 2022 to $48.60 billion in 2023 at a robust Compound Annual Growth Rate (CAGR) of 12.2%. Peering into the future, the market is expected to reach $73.58 billion in 2027, maintaining an impressive CAGR of 10.9%.

• Growth Momentum: The market demonstrates sustained momentum, fueled by technological advancements and a surge in demand for advanced packaging solutions.

Powering the Future: The Consumer Electronics Catalyst
The burgeoning demand for consumer electronics is poised to be a primary driver propelling the growth of the 3D IC and 2.5D IC packaging market. The realm of consumer electronics, encompassing a vast array of personal, daily, and non-commercial devices, is witnessing an upswing.

• Diverse Drivers for Demand: The surge in consumer electronics and gaming devices can be attributed to various factors, including technological advancements, increased disposable income, the expansion of the gaming industry, digital transformation, remote work trends, and changing lifestyle preferences.
• Sales Surge at LG: Notably, LG, a South Korea-based consumer electronics giant, reported a remarkable sales growth of 12.9% in 2022, surpassing approximately $52.70 billion. The LG Home Appliance & Air Solution Company also achieved record-breaking revenue of $22.5 billion in 2022, marking a 10.3% increase from the previous year.

Industry Pioneers: Leading the Charge
Major players in the 3D IC and 2.5D IC packaging market are at the forefront, steering the industry toward innovation and growth. The industry landscape includes prominent names like Samsung Electronics, Intel Corporation, Broadcom Inc., and many others.

• Diverse Player Landscape: The market benefits from the diverse expertise and contributions of leading companies, each playing a pivotal role in shaping the industry’s trajectory.

The Trend of Tech Advancements: Paving the Way Forward
In the fast-evolving landscape of 3D IC and 2.5D IC packaging, technological advancements emerge as a pivotal trend. Leading companies are harnessing new technologies to solidify their positions in the market.

• ASE’s VIPack: A case in point is ASE Technology Holding Co. Ltd., which, in June 2022, unveiled VIPack, an advanced packaging platform. This innovative platform facilitates vertically integrated package solutions, expanding design possibilities and delivering exceptional performance and density. Utilizing advanced technologies like redistribution layer (RDL) and 2.5D and 3D, VIPack empowers companies to integrate multiple chips seamlessly.

Unveiling Market Segmentation: A Nuanced Perspective
Understanding the dynamics of the 3D IC and 2.5D IC packaging market requires delving into its segmentation. Key facets include technology, application, and end-users.

• Market Segmentation Overview:
  1. Technology: 3D Wafer-Level Chip-Scale Packaging, 3D TSV (Through-Silicon Via), 2.5D
  2. Application: Logic, Memory, Imaging And Optoelectronics, MEMS Or Sensors, LED, Other Applications
  3. End-User: Telecommunication, Consumer Electronics, Automotive, Military And Aerospace, Medical Devices, Smart Technologies, Other End Users.

Regional Dynamics: Asia-Pacific Takes Center Stage
In the ever-evolving landscape of the 3D IC and 2.5D IC packaging market, Asia-Pacific emerges as a pivotal region. Not only was it the largest region in 2022, but it is also anticipated to be the fastest-growing in the forecast period.

• Asia-Pacific’s Dominance: The region’s dominance is a testament to its technological prowess, innovation, and rapid adoption of advanced packaging solutions.

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The 3D IC And 2.5D IC Packaging Global Market Report 2023  provides an overview of the 3D IC and 2.5D IC packaging market for the time series: historic years (2010 – 2021) and ten years forecast (2023 – 2032). The 3D IC and 2.5D IC packaging market forecast analyzes 3D IC and 2.5D IC packaging market size, 3D IC and 2.5D IC packaging market share, leading competitor and their market positions.

The Table Of Content For The 3D IC And 2.5D IC Packaging Market Include:
1. 3D IC And 2.5D IC Packaging Market Executive Summary
2. 3D IC And 2.5D IC Packaging Market Segments
3. 3D IC And 2.5D IC Packaging Market Size And 3D IC And 2.5D IC Packaging Market Growth Rate
4. Key 3D IC And 2.5D IC Packaging Market Trends
5. Major 3D IC And 2.5D IC Packaging Market Drivers
……
25. Key Mergers And Acquisitions In The 3D IC And 2.5D IC Packaging Market
26. Top 3D IC And 2.5D IC Packaging Companies
27. 3D IC And 2.5D IC Packaging Market Opportunities And Strategies
28. 3D IC And 2.5D IC Packaging Market, Conclusions And Recommendations
29. Appendix

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