The Business Research Company’s global market reports are now updated with the latest market sizing information for the year 2023 and forecasted to 2032

As per The Business Research Company’s High-Density Interconnect Global Market Report 2023, the worldwide high-density interconnect market is projected to increase from $12.9 billion in 2022 to $15.05 billion in 2023, with a compound annual growth rate (CAGR) of 16.6%. The market’s global size is anticipated to reach $22.36 billion in 2027, growing at a CAGR of 10.4%.

Asia-Pacific held the largest high density interconnect market share and was the fastest-growing region in 2022.

High Density Interconnect Market Driver

The expanding use of high-density interconnect (HDI) technology in the automotive industry is set to drive the HDI market’s growth. The automotive sector encompasses various organizations involved in vehicle design, development, manufacturing, marketing, sales, and maintenance. HDI technology offers several advantages to the automotive industry, including enhanced performance, increased reliability, improved signal transmission, reduced component size, and cost savings. For example, based on data from the Bureau of Transportation Statistics (BTS), new vehicle sales rose from 11,041 (Thousands of vehicles) in 2020 to 11,471 (Thousands of vehicles) in 2021. Hence, the expanding use of HDI technology in the automotive sector fuels market growth.

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Key High Density Interconnect Market Segments

The global high density interconnect market is segmented –

1) By Type: Single Panel, Double Panel, Other Types

2) By Substrate: Rigid, Flexible, Rigid-Flex

3) By End User: Automotive, Consumer Electronics, Telecommunications, Medical, Other End-Users

High Density Interconnect Market Prominent Players

Major players in the high density interconnect market are Unimicron Technology Corporation, TTM Technologies Inc., Austria Technologies & Systemtechnik AG, Zhen Ding Tech. Group, Meiko Electronics Co. Ltd., Fujitsu Limited, Multek Corporation, NCAB Group, Sierra Circuits Inc., Ibiden Co. Ltd., Samsung Electro-Mechanics, Unitech Printed Circuit Board Corp., Empresa Provincial de Energía de Córdoba, CMK Corporation, Nan Ya Printed Circuit Board Corporation, RayMing Technology Co. Ltd., Advanced Circuits Inc., Calumet Electronics Corporation, ChinaPCBOne Technology Limited, Epec Engineered Technologies, Flex PCB Inc., Hemeixin Electronics Co. Limited, King Sun PCB Technology Co. Ltd., Moko Technology Limited, RUSH PCB Inc, XPCB Limited, Sunstone Circuits LLC, and 3CEMS Group.

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Prominent High Density Interconnect Market Trend

High-density interconnect market sees a rising trend in technological advancements. Major companies in this sector are embracing new technologies to maintain their market position. For example, in May 2020, DuPont Electronics & Imaging Interconnect Solutions (ICS), a US-based integrated materials partner for high-performance interconnects, introduced advanced solutions for high-density interconnect applications in printed circuit boards. These solutions included next-gen via-fill electrolytic copper solutions and innovative ionic palladium catalyst solutions for horizontal electroless copper systems. These cutting-edge technologies offered enhanced reliability and productivity, catering to fine-line HDI applications across diverse sectors like cell phones, consumer electronics, telecommunications, and automobiles.

The High Density Interconnect Global Market Report 2023  provides comprehensive insights on the high density interconnect market size, trends and drivers, opportunities, strategies, and competitor analysis. The countries covered in the high density interconnect market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, the UK, and the USA, and the major seven regions are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, the Middle East, and Africa.

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