The Business Research Company’s global market reports are now updated with the latest market sizing information for the year 2023 and forecasted to 2032

The global flip chip market size grew from $30.81 billion in 2022 to $34.93 billion in 2023 at a compound annual growth rate (CAGR) of 13.4%. The Russia-Ukraine war disrupted the chances of global economic recovery from the COVID-19 pandemic, at least in the short term. The war between these two countries has led to economic sanctions on multiple countries, a surge in commodity prices, and supply chain disruptions, causing inflation across goods and services, and affecting many markets across the globe. The market size of the flip chip market size is expected to grow to $54.61 billion in 2027 at a CAGR of 11.8%.

The increase in sales of electronic products will propel the growth of the flip chips market during the forecast period

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Major Market Players in the Flip Chip market include 3M Company, Advanced Micro Devices Inc., Amkor Technology Inc., Apple Inc., Fujitsu Limited, Intel Corporation, IBM Corporation, Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company, Texas Instruments Inc., STMicroelectronics, Kyocera International, TDK Electronics, GlobalFoundries, UMC, ASE Inc., STATS ChipPAC, and Powertech Technology

Technological advancement is a key trend gaining popularity in the flip chip market. Companies in the flip chip market are focusing on developing technologies to strengthen their position in the market. For instance, In August 2021, ACM Research Inc., a US-based single-wafer wet cleaning equipment company, announced the launch of ACM’s Ultra ECP GIII plating tool to support wafer-level packaging (WLP) including, product offers for silicon carbide (SiC), gallium nitride (GaN), and gallium arsenide for compound semiconductors (GaAs). The tool can plate gold (Au) into backside deep hole processes with uniformity and step coverage.

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Global Flip Chip Market Segments Include:
1) By Packaging Technology: 3D IC, 2.5D IC, 2D IC

2) By Bumping Technology: Copper Pillar, Solder Bumping, Tin-Lead Eutectic Solder, Lead-Free Solder

3) By Industry: Electronics, Heavy Machinery and Equipment, IT and Telecommunication, Automotive, Other Industries

• By Geography: The market is segmented into North America, South America, Asia-Pacific, Eastern Europe, Western Europe, Middle East and Africa. Among these regions, Asia-Pacific is the largest region in the global Flip Chip market in 2021.

The Flip Chip Global Market Report 2023  provides an overview of the Flip Chip market for the time series: historic years (2010 – 2021) and ten years forecast (2023 – 2032). The Flip Chip market forecast analyzes Flip Chip market size, Flip Chip market share, leading competitor and their market positions.

Flip chips are also known as direct chip attach where interconnecting dies such as semiconductor devices, IC chips, integrated passive devices, and microelectromechanical systems (MEMS) are attached bond pad side down to a substrate or carrier. These have numerous benefits, such as lower cost, high packaging density, improved circuit reliability, and small dimensions. It is used in the flip-chip packaging process to link the chip and the substrate of a package carrier. Any surface of a flip chip can be interconnected, typically with copper, nickel, or soldered metal bumps. These bumps are installed on the die surface and aid in the electrical connection between the device and the box substrate.

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