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Rising demand for consumer electronic gadgets is likely to stimulate innovation in the manufacturing of through-hole passive components, propelling the market during the forecast period.

The global through-hole passive components market is expected to grow from $33.87 billion in 2022 to $36.41 billion in 2023 at a compound annual growth rate (CAGR) of 7.5%. The global through-hole passive component market size is expected to reach $46.61 billion in 2027 at a CAGR of 6.3%.

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 Global Through-Hole Passive Components Market Segments Include:

• By Component: Resistors, Capacitors, Inductors, Diodes, Transducers, Sensors, Other Components
• By Leads Model: Axial, Radial
• By Application: Consumer Electronics, Automotive, Industrial, IT And Telecom, Aerospace And Defense, Healthcare and Life Sciences, Other Applications
• By Geography: The market is segmented into North America, South America, Asia-Pacific, Eastern Europe, Western Europe, Middle East and Africa. Among these regions, Asia Pacific is the largest region in the global through-hole passive components market in 2021.

Major Market Players in the through-hole passive components market include Vishay Intertechnology Inc., YAGEO Corp., Murata Manufacturing Co. Ltd., KYOCERA AVX Components Corporation, Panasonic Holdings Corporation.

Product developments are a significant trend in the through-hole passive component market’s growth. Major players in the through-hole passive component market are focusing on providing unique solutions to strengthen their market position. For example, Diodes Incorporated, a US-based semiconductor manufacturer and supplier, debuted its first line of silicon carbide (SiC) Schottky barrier diodes (SBD) in January 2023. The portfolio includes eight DSCxx120 series 1200V products (2A, 5A, and 10A) and eleven DSCxxA065 series 650V products. The unique feature of this device is its broad bandgap for SBD, which delivers the benefits of considerably increased efficiency and high-temperature dependability while also responding to market demands for lower system operating costs and less maintenance.

The Through-Hole Passive Components Global Market Report 2023  provides a through-hole passive components market overview for the time series: historic years (2010 – 2021) and ten years forecast (2023 – 2032). The through-hole passive components market forecast analyzes through-hole passive components market size, through-hole passive components market share, leading competitor market positions. The regions covered in the report include Asia-Pacific, China, Western Europe, Eastern Europe, North America, USA, South America, Middle East and Africa and the countries include Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA.

Through-hole passive component refers to an electronic component mounting method that involves the usage of leads on the components. Manual assembly (hand placement) or automated insertion mounting devices are used to insert it into holes drilled in PCBs and solder it to pads on the other side.

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