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The rise of the consumer electronics industry is likely to drive future growth in the chemical mechanical polishing market.

The global chemical mechanical polishing market is expected to grow from $5.14 billion in 2022 to $5.58 billion in 2023 at a compound annual growth rate (CAGR) of 8.5%.The market is expected to reach $7.44 billion in 2027 at a CAGR of 7.4%.

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Global Chemical Mechanical Polishing Market Segments Include:

• By Type: CMP Equipment, CMP Consumable, Slurry, PAD, PAD Conditioner, Other Consumable Types
• By Equipment: Polishing and Grinding, Slurry Testing
• By Technology: Leading Edge, More than Moore’s, Emerging
• By Application: Compound Semiconductors, Integrated Circuits, MEMS (microelectromechanical systems) and NEMS (nanoelectromechanical systems), Other Applications
• By Geography: The market is segmented into North America, South America, Asia-Pacific, Eastern Europe, Western Europe, Middle East and Africa. Among these regions, Asia Pacific is the largest region in the global chemical mechanical polishing market in 2021.

Major Market Players in the chemical mechanical polishing market include Ebara Corporation, Applied Materials Inc., Cabot Microelectronics Corporation, Lapmaster Wolters GmbH, Fujimi Incorporated, CMC Materials Inc.

Production capacity advancement has emerged as a key trend gaining traction in the chemical mechanical polishing market. Major market players are focusing their efforts on boosting production capacity in order to strengthen their market position. Showa Denko Materials Co. Ltd., a Japan-based chemical company, for example, announced in December 2020 the expansion of its production capacity for polishing materials for flattening semiconductor circuits (CMP slurry), laminate materials for printed wiring boards, and photosensitive solder resists in its subsidiary Showa Denko Semiconductor Materials (Taiwan) Co., Ltd., as well as the construction of a new factory for CMP slurries in its subsidiary Showa Denko  These activities will cost the corporation approximately $0.15 million (20 billion yen).

The Chemical Mechanical Polishing Global Market Report 2023  provides a chemical mechanical polishing market overview for the time series: historic years (2010 – 2021) and ten years forecast (2023 – 2032). The chemical mechanical polishing market forecast analyzes chemical mechanical polishing market size, chemical mechanical polishing market share, leading competitor market positions. The regions covered in the report include Asia-Pacific, China, Western Europe, Eastern Europe, North America, USA, South America, Middle East and Africa and the countries include Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA.

Chemical Mechanical Polishing (CMP) is a semiconductor manufacturing technique that involves the smoothing and planar zing of semiconductor wafer surfaces. It is frequently used to remove undesirable material from the wafer surface, such as roughness, topography, and flaws, and to create a flat and smooth surface.

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