semiconductor assembly and packaging equipment market
Machinery

Insights Into The Semiconductor Assembly And Packaging Equipment Market’s Growth Opportunities Through 2023-2032 – Includes The Semiconductor Assembly And Packaging Equipment Market Size

The Business Research Company’s global market reports are now updated with the latest market sizing information for the year 2023 and forecasted to 2032

 

Rising demand for consumer electronics are expected to drive innovation in semiconductor assembly and packaging equipment manufacturing, thus driving the market during the forecast period.

 

The global semiconductor assembly and packaging equipment market is expected to from $10.44 billion in 2022 to $11.82 billion in 2023 at a compound annual growth rate (CAGR) of 13.3%. The global semiconductor assembly and packaging equipment market size is expected to grow to $18.72 billion in 2027 at a CAGR of 12.2%.

 

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Global Semiconductor Assembly And Packaging Equipment Market Segments Include:

  • By Type: Plating Equipment, Inspection and Dicing Equipment, Wire Bonding Equipment, Die-Bonding Equipment
  • By Application: Consumer Electronics, Healthcare Devices, Automotive, Enterprise Storage, Other Applications
  • By End-User: OSATs, IDMs
  • By Geography: The market is segmented into North America, South America, Asia-Pacific, Eastern Europe, Western Europe, Middle East and Africa. Among these regions, Asia Pacific is the largest region in the global semiconductor assembly and packaging equipment market in 2021.

 

Major Market Players in the semiconductor assembly and packaging equipment market include Amkor Technology, Tokyo Electron Limited, Lam Research Corporation, ASML Holding N.V, Applied Materials.

 

Technological advancements are a key trend gaining popularity in the semiconductor assembly and packaging equipment market. Major companies operating in the market are focused on introducing new technologies such as compound equipment for better packaging applications. For example, in January 2022, Shengmei Semiconductor equipment (Shanghai) Co., Ltd., a China-based provider of wafer process solutions for semiconductor foreground and advanced wafer-level packaging (WLP) applications, launched a series of integrated equipment to support compound semiconductor manufacturing. The compound semiconductor wet process product line includes gluing equipment, development equipment, photoresist de-gluing equipment, wet etching equipment, cleaning equipment and metal plating equipment, and is automatically compatible with flat edges or notched wafers.

 

The Semiconductor Assembly And Packaging Equipment Global Market Report 2023  provides a semiconductor assembly and packaging equipment market overview for the time series: historic years (2010 – 2021) and ten years forecast (2023 – 2032). The semiconductor assembly and packaging equipment market forecast analyzes semiconductor assembly and packaging equipment market size, semiconductor assembly and packaging equipment market share, leading competitor market positions. The regions covered in the report include Asia-Pacific, China, Western Europe, Eastern Europe, North America, USA, South America, Middle East and Africa and the countries include Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA.

 

Semiconductor assembly and packaging equipment refer to a device used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit.

 

Explore Similar Reports From The Business Research Company:

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