Learn about the global wafer processing equipment market through The Business Research Company, which provides information on wafer processing equipment market size, wafer processing equipment market drivers and restraints, wafer processing equipment market players, the COVID-19 impact on the wafer processing equipment market, and more.

The global wafer processing equipment market size is expected to grow from $126.26 billion in 2021 to $136.14 billion in 2022 at a compound annual growth rate (CAGR) of 7.8%. The global wafer processing equipment market size is expected to grow to $183.22 billion in 2026 at a compound annual growth rate (CAGR) of 7.7%.

Increasing demand for consumer electronic devices is expected to boost the growth of the wafer processing equipment market.

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The wafer processing equipment market consists of sales of wafer processing equipment by entities (organizations, sole traders, or partnerships) that are engaged in manufacturing wafer processing equipment used for processing wafer, which is a thin slice of semiconductor, such as crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. Only goods and services traded between entities or sold to end consumers are included.

Global Wafer Processing Equipment Market Segments Include:

By Equipment Type: Oxidation Systems, Diffusion Systems, Epitaxial Reactors, Photolithography Equipment, Other Equipment Types

By Application: MEMS, RFID, CMOS Image Sensor, Other Applications

By End Use: Medical, Military, Solar, Industrial, Other End Uses

By Geography: The market is segmented into North America, South America, Asia-Pacific, Eastern Europe, Western Europe, Middle East and Africa. Among these regions, Asia Pacific was the largest region in the wafer processing equipment market in 2021.

Growing demand for miniaturized wafers with the improved performance of devices is a leading trend in the wafer processing equipment market. Semiconductor substrates such as wafers are thinned down to final thicknesses of tens of µm. Most of the semiconductor wafers such as those used in memory, CIS, and power applications are thinned down to 100 µm-200 µm. Further thickness reduction with the necessity to maximize memory capacity of single packages, improved data transfer rates, power consumption mostly fuelled by mobile applications is required in the case of memory devices.

TBRC’s wafer processing equipment market report covers:

Major Market Players: Lam Research Corporation, Tokyo Electron Limited, Applied Materials Inc, SPTS Technologies Limited, Plasma-Therm LLC, Disco Corporation, Tokyo Seimitsu Co Ltd. (Accretech), Motorola Solutions Inc, KLA-Tencor Corporation, and Hitachi Kokusai Electronic Inc.

Regions: Asia-Pacific, China, Western Europe, Eastern Europe, North America, USA, South America, Middle East and Africa.

Countries: Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA.

Time Series: Five years historic (2016-21) and ten years forecast (2022-2026-2031)

The Wafer Processing Equipment Global Market Report 2022 – Market Size, Trends, And Global Forecast 2022-2026 is one of a series of new reports from The Business Research Company that provides wafer processing equipment market overviews, analyzes and forecasts market size, share, wafer processing equipment market players, wafer processing equipment market segments and geographies, leading competitor revenues, profiles and market shares.

TBRC’s wafer processing equipment market report identifies top countries and segments for opportunities and strategies based on market trends and leading competitors’ approaches.

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