How is the Three Dimensional (3D) Integrated Circuits (IC) Market Poised for Growth: Trends and Opportunities Through 2034
Get 20% off on Global Market Reports until March 31st! Use code FY25SAVE at checkout.
How has the three dimensional (3d) integrated circuits (ic) market grown in recent years?
The market size for three-dimensional (3D) integrated circuits (IC) has witnessed a significant expansion in the last few years. Its value is projected to rise from $12.41 billion in 2024 to $14.41 billion in 2025, exhibiting a compound annual growth rate (CAGR) of 16.1%. The surge in growth during the historical period is associated with the amplified demand for superior electronic goods, an escalating requirement for better energy efficiency, and the growing need for high-performing electronics.
How is the three dimensional (3d) integrated circuits (ic) market size expected to evolve during the forecast period?
The three dimensional (3D) integrated circuits (IC) market size is expected to see rapid growth in the next few years. It will grow to $25.83 billion in 2029 at a compound annual growth rate (CAGR) of 15.7%. The growth in the forecast period can be attributed to a spike in demand for smart devices and sophisticated integrations, an increase in investment in research and development activities, an increasing need for 3D ICs in sectors like servers and data hubs, and the military and aerospace sectors, growing need for semiconductor industries, expansion of IoT and AI technologies. Major trends in the forecast period include the constant need for miniaturization of devices, the use of advanced packaging technologies, heterogeneous integration of devices, a focus on sustainability and energy efficiency, the customization of 3D IC solutions for specific applications, the development of new materials for better performance and efficiency, and enhanced manufacturing processes to reduce costs.
Get your three dimensional (3d) integrated circuits (ic) market report here!
Which key drivers are propelling the three dimensional (3d) integrated circuits (ic) market’s growth?
The burgeoning semiconductor industry is seen as a key driver for the growth of the three-dimensional (3D) integrated circuit (IC) market. Comprising firms focused on the design, manufacture, and sale of semiconductor devices – critical components in many electronic products such as computers, smartphones, and industrial machinery – the sector is undergoing a significant expansion. This surge is largely due to the spread of consumer electronics like smartphones, tablets, and wearable devices, leading to increased demand for advanced semiconductor components. Further, the implementation of 5G networks necessitates the development of new semiconductor technologies to boost communication, speed up data transfer, and heighten connectivity. 3D ICs present several benefits for semiconductor applications, including superior performance, better power efficiency, space-saving, and effective thermal management. As an illustration, the Semiconductor Industry Association (SIA) reported that global semiconductor industry sales reached $49.1 billion in May 2024, marking a 19.3% rise from May 2023’s total of $41.2 billion and a 4.1% increase compared to April 2024’s total of $47.2 billion. Hence, the escalating needs of the semiconductor industry are pushing the growth of the three-dimensional (3D) integrated circuit (IC) market.
What are the market segments in the three dimensional (3d) integrated circuits (ic) industry?
The three dimensional (3D) integrated circuits (IC) market covered in this report is segmented –
1) By Components: Through Glass Vias (TGVs), Through Silicon Vias (TSVs), Other Components
2) By Technology: 3D Stacked Integrated Circuit (ICs), Monolithic 3D Integrated Circuit (ICs), Integration And Packaging Type
3) By Application: Aerospace And Industrial, Telecommunication And Information Technology (IT), Automotive, Consumer Electronics, Medical, Industrial, Other Applications
Subsegments:
1) By Through Glass Vias (TGVs): Glass Substrate For 3D ICs, TGV Fabrication Process, TGV Interconnects, High-Performance Glass For IC Packaging
2) By Through Silicon Vias (TSVs): Silicon Wafer For TSV Fabrication, TSV Interconnects and Via Formation, Copper TSVs, TSV Packaging Solutions, High-Density Tsvs For 3D ICs
3) By Other Components: Microbumps, Interposers, Microelectromechanical Systems (MEMS), Passive Components (Resistors, Capacitors), Thermal Management Components, Power Delivery Network (PDN) Components, Wafer Bonding Materials, Test And Inspection Components
Get your free sample now – explore exclusive market insights:
https://www.thebusinessresearchcompany.com/sample.aspx?id=18484&type=smp
Who are the key firms paving the way for growth in the three dimensional (3d) integrated circuits (ic) market?
Major companies operating in the three dimensional (3D) integrated circuits (IC) market are Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company (TSMC), Intel Corporation, International Business Machines Corporation, Qualcomm Incorporated, SK Hynix Inc., Broadcom Inc., Micron Technology Inc., NVIDIA Corporation, Toshiba Corporation, Advanced Micro Devices Inc. (AMD), ASML Holding N.V., Texas Instruments Incorporated, MediaTek Inc., STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Analog Devices Inc., Renesas Electronics Corporation, United Microelectronics Corporation, ON Semiconductor Corporation, GlobalFoundries Inc., Microchip Technology Incorporated, Marvell Technology Group Ltd., JCET Group, Xilinx Inc., Silicon Labs Inc., Rambus Inc.
How are evolving market trends shaping three dimensional (3d) integrated circuits (ic) Strategies?
Major corporations active in the Three Dimensional (3D) Integrated Circuits (IC) market are prioritizing the crafting of 3D ICs, custom-made to address specific applications or customer demands. Examples include the need for improving 5G radio frequency performance, which is part of their strategy to gain competitive edge, fulfill unique market stipulations, and boost income via specialized solutions. This 3D IC methodologies enhance 5G by incorporating several high-speed elements into a single package, thereby escalating performance, cutting down latency, and ensuring more streamlined and effective network infrastructure and appliances. For instance, in May 2024, the Taiwan-based multinational entity United Microelectronics Corporation, a well-renowned semiconductor organization, heralded the first-ever 3D IC solution for radio frequency silicon on insulator (RFSOI) technology, a tremendous leap forward in the age of 5G. This avant-garde technology, available via UMC’s 55nm RFSOI platform, allows for over 45% reduction in circuit footprint, facilitating the integration of additional RF elements into 5G appliances. This cutting-edge 3D IC solution helps tackle the radio frequency (RF) interference issue and paves the way for future advancements in 5G millimeter-wave (mmWave) technology.
Unlock exclusive market insights – purchase your research report now for a swift delivery!
https://www.thebusinessresearchcompany.com/purchaseoptions.aspx?id=18484
Which geographic areas are influencing the growth of the three dimensional (3d) integrated circuits (ic) market?
North America was the largest region in the three dimensional (3D) integrated circuit (IC) market in 2023. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the three dimensional (3D) integrated circuits (IC) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
Browse Through More Similar Reports By The Business Research Company:
Medium Voltage Circuit Breaker Global Market Report 2024
Somatostatin Analogs Global Market Report 2024
https://www.thebusinessresearchcompany.com/report/somatostatin-analogs-global-market-report
Application Specific Integrated Circuit Global Market Report 2024
About The Business Research Company:
With over 15000+ reports from 27 industries covering 60+ geographies, The Business Research Company has built a reputation for offering comprehensive, data-rich research and insights. Armed with 1,500,000 datasets, the optimistic contribution of in-depth secondary research, and unique insights from industry leaders, you can get the information you need to stay ahead in the game.
Contact us at:
The Business Research Company: https://www.thebusinessresearchcompany.com/
Americas +1 3156230293
Asia +44 2071930708
Europe +44 2071930708
Email us at [email protected]
Follow us on:
LinkedIn: https://in.linkedin.com/company/the-business-research-company
YouTube: https://www.youtube.com/channel/UC24_fI0rV8cR5DxlCpgmyFQ
Global Market Model: https://www.thebusinessresearchcompany.com/global-market-model
Found this article helpful? Share it on:
