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What fueled the previous growth in the High Bandwidth Memory (HBM) market?

The market size for high bandwidth memory (HBM) has observed a significant expansion in the past few years, anticipated to rise from $2.36 billion in 2024 to a substantial $3 billion in 2025. This corresponds to a compound annual growth rate (CAGR) of 27.3%. Several factors have contributed to the growth shown during the historic period, including improvements in graphics processing units (GPUs), the rise of big data and analytics, the development of artificial intelligence (AI) and machine learning (ML), escalated complexity of workloads, and elevated demand in high-performance computing (HPC).

What will be the high bandwidth memory (hbm) market size in the future?

Expectations for the High Bandwidth Memory (HBM) market size predict an unprecedented expansion over the forthcoming years. By 2029, it’s projected to rise to a value of $7.78 billion, indicating a 26.8% Compound Annual Growth Rate (CAGR). The massive growth predicted for the period can be traced back to numerous factors, such as the launch of 5G networks, the explosive growth of edge computing, increased incorporation of Internet of Things (IoT), the evolution of artificial intelligence and deep learning, and the uptick in Virtual Reality (VR) and Augmented Reality (AR) industry. The period also accompanies significant trends like the assimilation in self-driving vehicles, data center applications expansion, advancements in the gaming sector, mobile device improvements, and the groundbreaking innovations in wearable technology.

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What main drivers are fueling expansion in the high bandwidth memory (hbm) market?

The rise in requirements for high-performance computing (HPC) is anticipated to catalyze the expansion of the high-bandwidth memory (HBM) market. High-performance computing, involving the deployment of sophisticated computer technologies and systems, is designed to handle intricate and challenging tasks, to levels beyond those possible with conventional computing. High-bandwidth memory, employed in high-performance computing, offers processors faster and more effective data access by vertically stacking memory dies on a single package. This results in a noteworthy surge in bandwidth and decrease in latency, thereby improving the overall computational efficiency of applications that are data-intensive. For instance, in January 2023, the U.S Department of Energy committed to investing $1.8 million across six projects. These projects are aimed at enhancing energy efficiency and productivity within the manufacturing sector by utilizing the high-performance computing resources available at the U.S. National Laboratories. The department’s initiatives made use of HPC to tackle manufacturing hurdles, streamline processes, and foster prospects towards a clean energy future. Priorities include curbing carbon emissions in steel production, improving additive manufacturing to bring down CO2 emissions, and refining battery production for electric vehicles. Consequently, the surge in demand for high-performance computing is serving as a key driver for the growth of the high-bandwidth memory market.

What key areas define the segmentation of the global high bandwidth memory (hbm) market?

The high bandwidth memory (HBM) market covered in this report is segmented –

1) By Memory Type: Hybrid Memory Cube (HMC), High-Bandwidth Memory (HBM)

2) By Type: HBWPIM, HBM3, HBM2E, HBM2

3) By Application: Servers, Networking, Consumer, Automotive, Other Applications

Subsegments:

1) By Hybrid Memory Cube (HMC): HMC 1.0, HMC 2.0, HMC 3.0

2) By High-Bandwidth Memory (HBM): HBM1, HBM2, HBM2E, HBM3

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Who are the dominant players expanding their reach in the high bandwidth memory (hbm) market?

Major companies operating in the high bandwidth memory (HBM) market are Samsung Electronics Co. Ltd, Intel Corporation, International Business Machines (IBM) Corporation, Qualcomm Incorporated, SK Hynix Inc., Fujitsu Limited, Micron Technology Inc., Nvidia Corporation, Toshiba Corporation, Advanced Micro Devices Inc., Western Digital Corporation, STMicroelectronics SA, Renesas Electronics Corporation, Powerchip Technology Corporation, Cypress Semiconductor Corporation, Nanya Technology Corporation, Macronix International Co., Ltd., Silicon Motion Technology Corporation, Transcend Information Inc., Integrated Silicon Solution Inc. (ISSI), Adata Technology Co. Ltd., Netlist Inc., Open Silicon Inc., Micronet Ltd., Winbond Electronics Corporation

How are evolving market trends shaping high bandwidth memory (hbm) Strategies?

Leading corporations active in the high-bandwidth memory marketplace are concentrating on the production of advanced products such as energy-efficient data center processors to augment efficiency and performance. These processors aim to minimize environmental damage and maximize energy efficiency at data centers. For instance, in January 2023, Intel Corporation, a semiconductor computer circuits manufacturer from the US, introduced the 4th Gen Xeon Scalable processors (also known as Sapphire Rapids), the Xeon CPU Max Series (Sapphire Rapids HBM), and the Data Center GPU Max Series (Ponte Vecchio). These offerings provide customers with substantial improvements in efficiency, performance, security, and new capabilities spanning AI, cloud, edge, network, and high-end supercomputing in data centers.

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Which regions are emerging as leaders in the high bandwidth memory (hbm) market?

North America was the largest region in the high bandwidth memory (HBM) market in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the high bandwidth memory (HBM) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

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