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The increasing number of satellites are expected to drive innovation in radiation hardened electronics manufacturing, thus driving the market during the forecast period.

The global radiation hardened electronics market is expected to grow from $1.61 billion in 2022 to $1.69 billion in 2023 at a compound annual growth rate (CAGR) of 4.7%. The radiation-hardened electronics market size is expected to grow to $1.95 billion in 2027 at a CAGR of 3.6%.

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Global Radiation Hardened Electronics Market Segments Include:

• By Product Type: Commercial-Off-The-Shelf (COTS), Custom Made
• By Manufacturing Technique: Rad-Hard By Process, Rad-Hard By Design, Rad-Hard By Software
• By Component: Power Management, Application Specific Integrated Circuit, Logic, Memory, Field-Programmable Gate Array, Other Components
• By Application: Space Satellites, Commercial Satellites, Military, Aerospace and Defense, Nuclear Power Plants, Other Applications
• By Geography: The market is segmented into North America, South America, Asia-Pacific, Eastern Europe, Western Europe, Middle East and Africa. Among these regions, North America is the largest region in the global radiation hardened electronics market in 2021.

Major Market Players in the radiation hardened electronics market include Microchip Technology Inc., BAE Systems, Renesas Electronics Corporation, Infineon Technologies AG, STMicroelectronics, Xilinx Inc.

Technological advancement is a key trend gaining popularity in the radiation-hardened electronics market. Major companies operating in the radiation-hardened electronics market are focused on advanced technologies to strengthen their position in the market. For instance, in July 2021, Renesas Electronics Corporation, a Japan-based semiconductor manufacturer, launched a brand-new series of radiation-hardened (rad-hard), plastic-packaged components for satellite power management systems. The ISL71001SLHM/SEHM point of load (POL) buck regulator, the ISL71610SLHM and ISL71710SLHM digital isolators, and the ISL73033SLHM 100V GaN FET and integrated low-side driver are the four new devices. These devices are all made with Giant Magneto Resistive (GMR) isolation technology, which offers better radiation tolerance than the currently available space-grade optocouplers. It combines high levels of assurance with the board area savings and cost benefits of plastic packing.

The Radiation Hardened Electronics Global Market Report 2023 provides a radiation hardened electronics market overview for the time series: historic years (2010 – 2021) and ten years forecast (2023 – 2032). The radiation hardened electronics market forecast analyzes radiation hardened electronics market size, radiation hardened electronics market share, leading competitor market positions. The regions covered in the report include Asia-Pacific, China, Western Europe, Eastern Europe, North America, USA, South America, Middle East and Africa and the countries include Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA.

Radiation-hardened electronics or rad-hard electronics are single-board computer central processing units (CPUs), and sensors that have been designed and produced to be less prone to damage from exposure to radiation and exceptionally elevated temperatures. It is a process of making a component or a system resistant to the damages that can be caused by cosmic rays, ionizing and other electromagnetic radiations.

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