Machinery

Insights On The Semiconductor Assembly And Packaging Equipment Market Size And Growth Rate – Includes Semiconductor Assembly And Packaging Equipment Market Overview

December 26, 2022December 17, 2022 by The Business Research Company

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The semiconductor assembly and packaging equipment market is expected to grow from $7.99 billion in 2021 to $10.17 billion in 2022 at a compound annual growth rate (CAGR) of 27.2%.The market is expected to grow to $14.63 billion in 2026 at a CAGR of 9.5%.

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Semiconductor Assembly And Packaging Equipment Market Driver

Rising demand for consumer electronics is anticipated to contribute to the growth of the semiconductor assembly and packaging equipment market. Consumer electronics is a key segment that is entirely dependent on the semiconductor industry.

Semiconductor Assembly And Packaging Equipment Market Trends

The acquisition would help the company to enhance its products & services for foundry, logic, and memory customers along with further enhancing its single wafer processing system.

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Semiconductor Assembly And Packaging Equipment Market Segmentation By The Business Research Company

1) By Type: Plating Equipment, Inspection and Dicing Equipment, Wire Bonding Equipment, Die-Bonding Equipment

2) By Application: Consumer Electronics, Healthcare Devices, Automotive, Enterprise Storage, Other Applications

3) By End-User: OSATs, IDMs

Major Players And Regions Of The Semiconductor Assembly And Packaging Equipment Market

Major players in the semiconductor assembly and packaging equipment market are Amkor Technology, Tokyo Electron Limited, Lam Research Corporation, ASML Holding N.V, Applied Materials, KLA-Tencor, Hitachi High-Technologies Corporation, Advantest, Screen Holdings Co. Ltd, and Teradyne Inc.

Asia Pacific was the largest region in the semiconductor assembly and packaging equipment market in 2021.

The Semiconductor Assembly And Packaging Equipment Market Report 2022 covers regional data on key drivers, opportunities, and strategies for the seven major regions of the world that are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa. The report includes market size and forecast market shares for all the regions and countries with respect to the major players of the semiconductor assembly and packaging equipment market.

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