Learn about the global semiconductor assembly and packaging equipment market through The Business Research Company, which provides information on semiconductor assembly and packaging equipment market size, semiconductor assembly and packaging equipment market drivers and restraints, semiconductor assembly and packaging equipment market players, the COVID-19 impact on the semiconductor assembly and packaging equipment market, and more.

The global semiconductor assembly and packaging equipment market size is expected to grow from $7.99 billion in 2021 to $10.28 billion in 2022 at a compound annual growth rate (CAGR) of 28.6%. The global semiconductor assembly and packaging equipment market size is expected to grow to $16.25 billion in 2026 at a compound annual growth rate (CAGR) of 12.1%.

Rising demand for consumer electronics is anticipated to contribute to the growth of the semiconductor assembly and packaging equipment market.

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The semiconductor assembly and packaging equipment market consists of sales of semiconductor assembly and packaging equipment by entities (organizations, sole traders, or partnerships) that are engaged in manufacturing equipment used for semiconductor assembly and packaging. Only goods and services traded between entities or sold to end consumers are included.

Global Semiconductor Assembly And Packaging Equipment Market Segments Include:

By Type: Plating Equipment; Inspection and Dicing Equipment; Wire Bonding Equipment; Die-Bonding Equipment

By Application: Consumer Electronics; Healthcare Devices; Automotive; Enterprise Storage; Other Applications

By End-User: OSATs; IDMs

By Geography: The market is segmented into North America, South America, Asia-Pacific, Eastern Europe, Western Europe, Middle East and Africa. Among these regions, Asia Pacific was the largest region in the semiconductor assembly and packaging equipmen market in 2021.

The acquisition would help the company to enhance its products & services for foundry, logic, and memory customers along with further enhancing its single wafer processing system. Kokusai Electric Corporation is a Japan-based manufacturer of semiconductor manufacturing systems.

TBRC’s semiconductor assembly and packaging equipment market report covers:

Major Market Players: Amkor Technology, Tokyo Electron Limited, Lam Research Corporation, ASML Holding N.V, Applied Materials, KLA-Tencor, Hitachi High-Technologies Corporation, Advantest, Screen Holdings Co. Ltd, and Teradyne Inc.

Regions: Asia-Pacific, China, Western Europe, Eastern Europe, North America, USA, South America, Middle East and Africa.

Countries: Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA.

Time Series: Five years historic (2016-21) and ten years forecast (2022-2026-2031)

The Semiconductor Assembly And Packaging Equipment Global Market Report 2022 – Market Size, Trends, And Global Forecast 2022-2026 is one of a series of new reports from The Business Research Company that provides semiconductor assembly and packaging equipment market overviews, analyzes and forecasts market size, share, semiconductor assembly and packaging equipment market players, semiconductor assembly and packaging equipment market segments and geographies, leading competitor revenues, profiles and market shares.

TBRC’s semiconductor assembly and packaging equipment market report identifies top countries and segments for opportunities and strategies based on market trends and leading competitors’ approaches.

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