Global Advanced Packaging Technologies Market Report 2021 – Opportunities And Strategies, Market Forecast And Trends
The Global Advanced Packaging Technologies Market Report by The Business Research Company covers advanced packaging technologies market drivers and restraints, advanced packaging technologies market size, major players, and the impact of COVID-19 on the advanced packaging technologies market.
The advanced packaging technologies market consists of sales of advanced packaging technologies by entities (organizations, sole traders and partnerships) that provide various packaging techniques based on parameters such as power consumption, operating conditions, measurable size, and cost. Advanced packaging technologies are a collection of techniques that include 2.5D 3D-IC, wafer-level packaging, and more. It allows integrated circuits to be enclosed in a casing, which protects metallic parts from corrosion and physical damage.
The global advanced packaging technologies market is expected to grow from $4.31 billion in 2020 to $4.94 billion in 2021 at a compound annual growth rate (CAGR) of 14.7%. The growth in the advanced packaging technologies market is mainly due to the companies resuming their operations and adapting to the new normal while recovering from the COVID-19 impact, which had earlier led to restrictive containment measures involving social distancing, remote working, and the closure of commercial activities that resulted in operational challenges. The market is expected to reach $8.11 billion in 2025 at a CAGR of 13.2%.
The growing demand for consumer electronics is expected to drive the growth of the advanced packaging market in the coming years. Any electronic equipment intended to be bought and used by end-users or individuals for regular and non-commercial/professional purposes is referred to as consumer electronics (CE). Electronic devices must give more functionality with more processing power and faster speeds, resulting in increased module complexity. Advanced packaging technologies provide very reliable materials, function well, and are minimal in cost.
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Some advanced packaging technologies market trends include growing technological advancements. Major companies operating in the advanced packaging technologies sector are focused on developing technological solutions for advanced packaging to expand their leadership in semiconductor solutions.
Global advanced packaging technologies market segments include:
1) By Type: 3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Others
2) By Product: Active Packaging, Smart And Intelligent Packaging
3) By End Use Industry: Automotive And Transport, Consumer Electronics, Industrial, IT And Telecommunication, Others
By Geography: The market is segmented into North America, South America, Asia-Pacific, Eastern Europe, Western Europe, Middle East and Africa.
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The Advanced Packaging Technologies Global Market Report 2021: COVID-19 Growth and Change is one of a series of new reports from The Business Research Company that provides advanced packaging technologies market overviews, analyzes and forecasts market size, share, advanced packaging technologies market players, advanced packaging technologies market segments and geographies, market’s leading competitors’ revenues, profiles and market shares.
The advanced packaging technologies identifies top countries and segments for opportunities and strategies based on market trends and leading competitors’ approaches.
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Read Advanced Packaging Technologies Global Market Report 2021: COVID-19 Growth and Change from The Business Research Company for information on the following:
Data Segmentations: Market Size, Global, By Region And By Country; Historic And Forecast Size, And Growth Rates For The World, 7 Regions And 12 Countries
Market Players Covered: Amkor Technology, Intel, Advanced Semiconductor Engineering (ASE), Taiwan Semiconductor Manufacturing Company, Samsung Electronics, STATS ChipPAC, Qualcomm Technologies, IBM, Brewer Science, SÜSS Microtec, Renesas Electronics Corporation, Texas Instruments, Siliconware Precision Industries, Jiangsu Changjiang Electronics Technology, China WLCSP Co. LTD., Deca Technologies, Greatek Electronics, Powertech Technology, Sanmina Corporation, SFA Semicon, Universal Instruments Corporation, and Tongfu Microelectronics.
Regions: Asia-Pacific, China, Western Europe, Eastern Europe, North America, USA, South America, Middle East and Africa.
Countries: Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA.
Time Series: Five years historic (2015-20) and ten years forecast (2021-2025-2030)
Other Information And Analyses: SWOT analysis, customer information, market product/service analysis – product examples, trends and opportunities, drivers and restraints, key mergers and acquisitions, suggested trend based strategies, impact of COVID-19 on the market, future outlook and potential analysis, key metrics covered: number of enterprises, number of employees, global market in 2021 – countries offering most new opportunities, conclusions and recommendations by expert analysts.
Sourcing and Referencing: Data and analysis throughout the report are sourced using end notes.
Strategies For Participants In The Advanced Packaging Technologies Industry: The report explains a number of strategies for companies in the market, based on industry trends and company analysis.
Opportunities For Companies In The Advanced Packaging Technologies Sector: The report reveals where the global industry will put on most $ sales up to 2023.
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